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| QFP-SD Stacked Die Quad Flat Pack * Stacking of die enables more functionality and integration in a conventional QFP package FEATURES * Combining devices into one package reduces PCB real estate and cost * Increased sub-system performance by integrating multiple chips into a single package * Die to die bonding capability for device/signal integration * Standard and green/lead-free materials and Pb-free plating * Options for mixed technologies, 2 or more stacked dice * Fine pitch bonding capability * Exposed pad provides enhanced thermal performance * Low profile package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD); 1.00mm (TQFP-ep-SD) * Lead pitch ranges from 0.80mm to 0.40mm * Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to 216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD) * JEDEC standard compliant package outlines DESCRIPTION STATS ChipPAC's Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die low profile QFP. LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance. TQFP-ep-SD is a thin profile exposed pad version with enhanced thermal performance. STATS ChipPAC's chip stacking technology allows the integration of multiple ICs within a single package to improve package performance and functionality while reducing overall package size and cost. The die to die wire bonding capability enables device/signal integration to improve electrical performance and reduce overall package I/O requirements. STATS ChipPAC's Stacked Die QFPs with nominal package thickness of 1.40mm and 1.00mm are suitable for a variety of product applications. Stacked Die QFP packages are currently available in LQFP, LQFP-ep and TQFP-ep configurations, and are offered in standard and green/lead-free bill of materials. APPLICATIONS Suitable for a variety of applications including memory integration (ASIC or Logic), chipset integration (Analog/ Digital), mixed technologies integration (Baseband/RF), handheld products (Cellular Phones, Pagers, MP3 Players, GPS), consumer electronics (Internet applications, Digital Cameras/Camcorders), computers (Network PCs), and PC peripherals (Disk Drivers, CD-R/RW, DVD Drivers). www.statschippac.com QFP-SD Stacked Die Quad Flat Pack SPECIFICATIONS Die Thickness Package Body Thickness Marking Packing Options 100-600m (4-24mils) 1.0, 1.4mm Laser/ink JEDEC tray/tape and reel RELIABILITY Moisture Sensitivity Level Temperature Cycling High Temperature Storage Pressure Cooker Test Temperature/Humidity Test JEDEC Level 3, 260C reflow Condition C (-65C to 150C) 1000 cycles 150C, 1000 hrs 121C/100% RH/2 atm, 168 hrs 85C/85% RH, 1000 hrs ELECTRICAL PERFORMANCE Package (mm) 7 x 7 (32L) Pad Size (mm) 138 x 138 Lead/Wire (mm) 1.4-2.2 2 14 x 14 (128L) 275 x 275 3.0-4.5 2 Note: Results are simulated values at 100MHz. Resistance (mOhm) 11.0-18.0 120 24.0-36.0 120 Inductance Self (nH) Mutual (nH) 0.64-0.99 1.65 1.96-2.92 1.65 0.31-0.49 0.45-0.85 1.08-1.61 0.45-0.85 Capacitance Self (pF) Mutual (pF) 0.21-0.33 0.1 0.69-1.03 0.1 0.07-0.12 0.01-0.02 0.31-0.45 0.01-0.02 THERMAL PERFORMANCE The thermal performance of each die in the stack is influenced by other die in the stack. Thermal performance is highly dependent on package size, die size, substrate layers and thickness, and lead configuration. Simulation for specific applications should be performed. CROSS-SECTION LQFP-SD PACKAGE CONFIGURATIONS Package Size LQFP-SD LQFP-ep-SD TQFP-ep-SD Body Size (mm) 7 x 7 to 28 x 28 10 x 10 to 24 x 24 7 x 7 to 14 x 14 Lead Count 32 to 208 64 to 216 32 to 100 LQFP-ep-SD TQFP-ep-SD Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 Global Offices USA 510-979-8000 JAPAN 81-3-5789-5850 CHINA 86-21-5976-5858 MALAYSIA 603-4257-6222 KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 UK 44-1483-413-700 NETHERLANDS 31-38-333-2023 The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. (c)Copyright 2006. STATS ChipPAC Ltd. All rights reserved. May 2006 |
Price & Availability of QFP-SD
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